UNISEM (M) BERHAD

UNISEM (M) BERHAD stands as one of Malaysia’s quietly powerful technology enablers — a company that operates behind the scenes of the world’s digital evolution.

While its name may not appear on consumer products, its work exists within them — embedded in devices, systems, and technologies that define modern life.

Its journey reflects a powerful truth — that the most critical players in technology are often the least visible.

Founder:

Established by Malaysian semiconductor pioneers

Current Leadership:

Executive leadership under Unisem Group

The leadership continues to advance precision engineering, semiconductor capability, and global manufacturing relevance.

Some companies build brands — UNISEM builds what powers them.

In 1989, as Malaysia’s semiconductor ecosystem was still emerging, UNISEM focused not on finished products, but on the invisible layer beneath them — integrated circuits, packaging, and testing.

These were not visible to consumers, but essential to every electronic system.

As global demand for electronics accelerated, the need for precision assembly and validation grew.

UNISEM positioned itself within this critical segment, evolving from a local operation into a trusted partner within global supply chains.

From assembly to advanced packaging and testing, from local facility to international operations, it expanded into wafer bumping, probing, and complex IC packaging, serving multinational clients across industries.

Its facilities in Malaysia and China became integral to global semiconductor manufacturing networks.

From unseen processes to global integration, its journey reflects a powerful truth — that precision at the smallest scale enables impact at the largest scale.

Core Activities include:

• Semiconductor assembly and packaging

• Wafer processing and bumping services

• Integrated circuit testing including analog, digital, and RF

• Turnkey manufacturing and engineering solutions

The Group’s operational model focuses on outsourced semiconductor assembly and test services, advanced packaging technologies, wafer-level processes, engineering support, and global customer integration. By combining assembly, testing, wafer bumping, probing, and turnkey semiconductor solutions, UNISEM (M) BERHAD positions itself as both a backend semiconductor manufacturer and a strategic technology supply chain partner.

Notable Offerings Include:

• IC packaging and substrate technologies

• Wafer bumping and wafer-level CSP solutions

• Mixed-signal and RF semiconductor testing

• End-to-end assembly and test services

These offerings have enabled UNISEM (M) BERHAD to serve global semiconductor companies, electronics manufacturers, automotive technology players, communications firms, and industrial technology customers. Its services support chip packaging, performance testing, miniaturisation, reliability, and scalable electronics production.

1989 – Incorporation of UNISEM (M) BERHAD

1990s – Expansion into semiconductor assembly and testing services

2000s – Development of advanced packaging and wafer technologies

2010s – International expansion including China manufacturing facilities

2020s – Strengthening role in global semiconductor supply chain

UNISEM (M) BERHAD has positioned Malaysia as a key semiconductor hub by strengthening backend semiconductor capabilities in assembly, packaging, wafer processing, and testing.

The Group has supported global electronics and technology manufacturing by enabling semiconductor companies to scale production with reliable outsourced assembly and test services.

Through its advanced packaging and RF testing capabilities, Unisem has contributed to supply chains serving communications, consumer electronics, automotive, industrial, and other high-growth technology sectors.

Its role reflects Malaysia’s importance in the global semiconductor ecosystem, particularly in the precision backend processes that make modern electronics functional and scalable.

Some companies create products — UNISEM enables the world to create them.

From precision assembly to global integration, its legacy is not defined by visibility, but by necessity.

Its journey stands as a testament that the smallest components often carry the greatest impact.